TY - GEN
T1 - A study of microstructure and properties of Cu-Ni-Sn alloy when deformation and aging
AU - Vo, Dinh Tung
AU - Nguyen, Duong Nam
AU - Sai, Manh Thang
AU - Said, Zafar
AU - Nguyen, Xuan Phuong
AU - Nguyen, Dinh Tuyen
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - In this paper, the results about the structural and mechanical properties of Cu-Ni-Sn alloy under deformation and heat treatment are presented. By analytical methods XRD have determined the appearance of spinodal clusters in the microstructure of the alloy. By XRD analysis, it was shown that the difference in crystal structure parameters of the alloys studied after deformation and heat treatment. The deviation corresponding to some crystal structure parameters is consistent with the theory of spinodal decomposition in alloys. The change in the structure of the alloy leads to a change in the alloy's mechanical properties: the alloy's elastic limit reaches 1097.5MPa; elongation of the alloy is 14%. After thermal-mechanical treatment the alloy's hardness reaches 40HRC.
AB - In this paper, the results about the structural and mechanical properties of Cu-Ni-Sn alloy under deformation and heat treatment are presented. By analytical methods XRD have determined the appearance of spinodal clusters in the microstructure of the alloy. By XRD analysis, it was shown that the difference in crystal structure parameters of the alloys studied after deformation and heat treatment. The deviation corresponding to some crystal structure parameters is consistent with the theory of spinodal decomposition in alloys. The change in the structure of the alloy leads to a change in the alloy's mechanical properties: the alloy's elastic limit reaches 1097.5MPa; elongation of the alloy is 14%. After thermal-mechanical treatment the alloy's hardness reaches 40HRC.
KW - Cu-Ni-Sn alloys
KW - mechanical properties
KW - spinodal decomposition
KW - thermal-mechanical treatment
UR - http://www.scopus.com/inward/record.url?scp=85128369159&partnerID=8YFLogxK
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U2 - 10.1109/ASET53988.2022.9734930
DO - 10.1109/ASET53988.2022.9734930
M3 - Conference contribution
AN - SCOPUS:85128369159
T3 - 2022 Advances in Science and Engineering Technology International Conferences, ASET 2022
BT - 2022 Advances in Science and Engineering Technology International Conferences, ASET 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2022 Advances in Science and Engineering Technology International Conferences, ASET 2022
Y2 - 21 February 2022 through 24 February 2022
ER -