TY - GEN
T1 - A Thermal Stress Sharing Voltage Source Inverter and Sequential PWM Technique for Lifetime Enhancement of IGBTs
AU - Kiranmai, K. S.Phani
AU - Damodaran, Roopa Viswadev
AU - Hushki, Mohammad
AU - Shareef, Hussain
N1 - Funding Information:
The research was supported by the United Arab Emirates University.
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - The failure of voltage source inverter (VSI) is primarily caused by thermal stress across its component switches. In the commonly used H-bridge VSI, the switches experience considerable thermal stress thereby reducing its reliability and lifetime. Hence, this paper presents a thermal stress sharing single phase VSI (TSSI) to decrease the thermal stress and prolong the lifetime of IGBTs. The proposed TSSI incorporates switches in parallel to the existing switches of H-bridge VSI in order to achieve thermal sharing. To ensure appropriate operation of parallel switches, a novel sequential pulse width modulation (Seq-PWM) technique is devised. The improvement in lifetime expectancy of proposed TSSI with Seq-PWM is evaluated by comparing power loss and thermal analysis with those of H-bridge VSI with conventional PWMs. The theoretical analysis is validated with simulations in PLECS software and experiments on a hardware prototype. The results suggests that the life-span of the TSSI with Seq-PWM is improved multi-fold. Therefore, due to its increased lifespan, the proposed TSSI with Seq-PWM is expected to save the expenses of frequent replacement of VSIs.
AB - The failure of voltage source inverter (VSI) is primarily caused by thermal stress across its component switches. In the commonly used H-bridge VSI, the switches experience considerable thermal stress thereby reducing its reliability and lifetime. Hence, this paper presents a thermal stress sharing single phase VSI (TSSI) to decrease the thermal stress and prolong the lifetime of IGBTs. The proposed TSSI incorporates switches in parallel to the existing switches of H-bridge VSI in order to achieve thermal sharing. To ensure appropriate operation of parallel switches, a novel sequential pulse width modulation (Seq-PWM) technique is devised. The improvement in lifetime expectancy of proposed TSSI with Seq-PWM is evaluated by comparing power loss and thermal analysis with those of H-bridge VSI with conventional PWMs. The theoretical analysis is validated with simulations in PLECS software and experiments on a hardware prototype. The results suggests that the life-span of the TSSI with Seq-PWM is improved multi-fold. Therefore, due to its increased lifespan, the proposed TSSI with Seq-PWM is expected to save the expenses of frequent replacement of VSIs.
KW - Lifetime enhancement
KW - power loss
KW - pulse width modulation
KW - single phase VSI
KW - thermal stress analysis
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U2 - 10.1109/ICECCME55909.2022.9988054
DO - 10.1109/ICECCME55909.2022.9988054
M3 - Conference contribution
AN - SCOPUS:85146432882
T3 - International Conference on Electrical, Computer, Communications and Mechatronics Engineering, ICECCME 2022
BT - International Conference on Electrical, Computer, Communications and Mechatronics Engineering, ICECCME 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2022 International Conference on Electrical, Computer, Communications and Mechatronics Engineering, ICECCME 2022
Y2 - 16 November 2022 through 18 November 2022
ER -