A total-concentration fixed-grid method for two-dimensional diffusion-controlled wet chemical etching

P. Rath; J. C. Chai; H. Y. Zheng; Y. C. Lam; V. M. Murukeshan

doi:10.1115/HT2005-72186

A total-concentration fixed-grid method for two-dimensional diffusion-controlled wet chemical etching

P. Rath, J. C. Chai, H. Y. Zheng, Y. C. Lam, V. M. Murukeshan

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

This article presents a total concentration method for two-dimensional wet chemical etching. The proposed procedure is a fixed-grid approach. It is analogous to the enthalpy method used for modeling melting/solidification problems. The governing equation is formulated using the total concentration of the etchant. It includes the reacted and the unreacted concentrations of the etchant. The proposed governing equation includes the interface condition. The reacted concentration is used to capture the etchant-substrate interface implicitly. Since the grids are fixed, a diffusion problem remains a diffusion problem unlike the moving grid approach where the diffusion problem becomes the convection-diffusion problem due to the mesh velocity. For demonstration purposes, the finite volume method is used to solve for the transient concentration distribution of etchant. In this article, two-dimensional diffusion-controlled wet chemical etching processes are modeled. The results obtained from the proposed total concentration method are compared with available "analytic" solutions and solutions from moving-grid approach.

Original language	English
Title of host publication	Proceedings of the ASME Summer Heat Transfer Conference, HT 2005
Pages	113-119
Number of pages	7
DOIs	https://doi.org/10.1115/HT2005-72186
Publication status	Published - 2005
Externally published	Yes
Event	2005 ASME Summer Heat Transfer Conference, HT 2005 - San Francisco, CA, United States Duration: Jul 17 2005 → Jul 22 2005

Publication series

Name	Proceedings of the ASME Summer Heat Transfer Conference
Volume	3

Conference

Conference	2005 ASME Summer Heat Transfer Conference, HT 2005
Country/Territory	United States
City	San Francisco, CA
Period	7/17/05 → 7/22/05

ASJC Scopus subject areas

General Engineering

Access to Document

10.1115/HT2005-72186

Cite this

Rath, P., Chai, J. C., Zheng, H. Y., Lam, Y. C., & Murukeshan, V. M. (2005). A total-concentration fixed-grid method for two-dimensional diffusion-controlled wet chemical etching. In Proceedings of the ASME Summer Heat Transfer Conference, HT 2005 (pp. 113-119). Article HT2005-72186 (Proceedings of the ASME Summer Heat Transfer Conference; Vol. 3). https://doi.org/10.1115/HT2005-72186

A total-concentration fixed-grid method for two-dimensional diffusion-controlled wet chemical etching. / Rath, P.; Chai, J. C.; Zheng, H. Y. et al.
Proceedings of the ASME Summer Heat Transfer Conference, HT 2005. 2005. p. 113-119 HT2005-72186 (Proceedings of the ASME Summer Heat Transfer Conference; Vol. 3).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Rath, P, Chai, JC, Zheng, HY, Lam, YC & Murukeshan, VM 2005, A total-concentration fixed-grid method for two-dimensional diffusion-controlled wet chemical etching. in Proceedings of the ASME Summer Heat Transfer Conference, HT 2005., HT2005-72186, Proceedings of the ASME Summer Heat Transfer Conference, vol. 3, pp. 113-119, 2005 ASME Summer Heat Transfer Conference, HT 2005, San Francisco, CA, United States, 7/17/05. https://doi.org/10.1115/HT2005-72186

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AB - This article presents a total concentration method for two-dimensional wet chemical etching. The proposed procedure is a fixed-grid approach. It is analogous to the enthalpy method used for modeling melting/solidification problems. The governing equation is formulated using the total concentration of the etchant. It includes the reacted and the unreacted concentrations of the etchant. The proposed governing equation includes the interface condition. The reacted concentration is used to capture the etchant-substrate interface implicitly. Since the grids are fixed, a diffusion problem remains a diffusion problem unlike the moving grid approach where the diffusion problem becomes the convection-diffusion problem due to the mesh velocity. For demonstration purposes, the finite volume method is used to solve for the transient concentration distribution of etchant. In this article, two-dimensional diffusion-controlled wet chemical etching processes are modeled. The results obtained from the proposed total concentration method are compared with available "analytic" solutions and solutions from moving-grid approach.

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A total-concentration fixed-grid method for two-dimensional diffusion-controlled wet chemical etching

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