Assembly and packaging of liquid-crystal-on-silicon displays

Peter T. Kazlas; Kristina M. Johnson; Yung Cheng Lee; Saeed Hareb

doi:10.1117/12.305491

Assembly and packaging of liquid-crystal-on-silicon displays

Peter T. Kazlas, Kristina M. Johnson, Yung Cheng Lee, Saeed Hareb

Department of Mechanical and Aerospace Engineering

Research output: Contribution to journal › Conference article › peer-review

4 Citations (Scopus)

Abstract

This paper reviews the assembly and packaging of miniature liquid-crystal-on-silicon (LCOS) displays. Reflective-mode LCOS displays require thin cell gaps (<5 μm) with strict tolerances (cell gap deviation <200 nm) - a difficult optoelectronics assembly problem. Important assembly and packaging considerations include the substrate thermal properties, substrate flatness and packaging chronology. Two approaches are described: spatial light modulator assembly using self-pulling solder reflow and wafer scale display assembly using photo-definable resins. Simulation and experimental results are summarized.

Original language	English
Pages (from-to)	52-59
Number of pages	8
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	3289
DOIs	https://doi.org/10.1117/12.305491
Publication status	Published - Dec 1 1998
Event	Micro-Optics Integration and Assemblies - San Jose, CA, United States Duration: Jan 29 1998 → Jan 30 1998

Keywords

Assembly
Miniature liquid-crystal-on-silicon displays
Packaging
Solder reflow
Spatial light modulators

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.305491

Cite this

@article{035be3e53cf44e16a4cef0d9334d3448,

title = "Assembly and packaging of liquid-crystal-on-silicon displays",

abstract = "This paper reviews the assembly and packaging of miniature liquid-crystal-on-silicon (LCOS) displays. Reflective-mode LCOS displays require thin cell gaps (<5 μm) with strict tolerances (cell gap deviation <200 nm) - a difficult optoelectronics assembly problem. Important assembly and packaging considerations include the substrate thermal properties, substrate flatness and packaging chronology. Two approaches are described: spatial light modulator assembly using self-pulling solder reflow and wafer scale display assembly using photo-definable resins. Simulation and experimental results are summarized.",

keywords = "Assembly, Miniature liquid-crystal-on-silicon displays, Packaging, Solder reflow, Spatial light modulators",

author = "Kazlas, {Peter T.} and Johnson, {Kristina M.} and Lee, {Yung Cheng} and Saeed Hareb",

year = "1998",

month = dec,

day = "1",

doi = "10.1117/12.305491",

language = "English",

volume = "3289",

pages = "52--59",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "Micro-Optics Integration and Assemblies ; Conference date: 29-01-1998 Through 30-01-1998",

}

TY - JOUR

T1 - Assembly and packaging of liquid-crystal-on-silicon displays

AU - Kazlas, Peter T.

AU - Johnson, Kristina M.

AU - Lee, Yung Cheng

AU - Hareb, Saeed

PY - 1998/12/1

Y1 - 1998/12/1

N2 - This paper reviews the assembly and packaging of miniature liquid-crystal-on-silicon (LCOS) displays. Reflective-mode LCOS displays require thin cell gaps (<5 μm) with strict tolerances (cell gap deviation <200 nm) - a difficult optoelectronics assembly problem. Important assembly and packaging considerations include the substrate thermal properties, substrate flatness and packaging chronology. Two approaches are described: spatial light modulator assembly using self-pulling solder reflow and wafer scale display assembly using photo-definable resins. Simulation and experimental results are summarized.

AB - This paper reviews the assembly and packaging of miniature liquid-crystal-on-silicon (LCOS) displays. Reflective-mode LCOS displays require thin cell gaps (<5 μm) with strict tolerances (cell gap deviation <200 nm) - a difficult optoelectronics assembly problem. Important assembly and packaging considerations include the substrate thermal properties, substrate flatness and packaging chronology. Two approaches are described: spatial light modulator assembly using self-pulling solder reflow and wafer scale display assembly using photo-definable resins. Simulation and experimental results are summarized.

KW - Assembly

KW - Miniature liquid-crystal-on-silicon displays

KW - Packaging

KW - Solder reflow

KW - Spatial light modulators

UR - http://www.scopus.com/inward/record.url?scp=0032225526&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032225526&partnerID=8YFLogxK

U2 - 10.1117/12.305491

DO - 10.1117/12.305491

M3 - Conference article

AN - SCOPUS:0032225526

SN - 0277-786X

VL - 3289

SP - 52

EP - 59

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Micro-Optics Integration and Assemblies

Y2 - 29 January 1998 through 30 January 1998

ER -

Assembly and packaging of liquid-crystal-on-silicon displays

Abstract

Keywords

ASJC Scopus subject areas

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