Abstract
This paper reviews the assembly and packaging of miniature liquid-crystal-on-silicon (LCOS) displays. Reflective-mode LCOS displays require thin cell gaps (<5 μm) with strict tolerances (cell gap deviation <200 nm) - a difficult optoelectronics assembly problem. Important assembly and packaging considerations include the substrate thermal properties, substrate flatness and packaging chronology. Two approaches are described: spatial light modulator assembly using self-pulling solder reflow and wafer scale display assembly using photo-definable resins. Simulation and experimental results are summarized.
| Original language | English |
|---|---|
| Pages (from-to) | 52-59 |
| Number of pages | 8 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 3289 |
| DOIs | |
| Publication status | Published - 1998 |
| Event | Micro-Optics Integration and Assemblies - San Jose, CA, United States Duration: Jan 29 1998 → Jan 30 1998 |
Keywords
- Assembly
- Miniature liquid-crystal-on-silicon displays
- Packaging
- Solder reflow
- Spatial light modulators
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering
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