Bonding techniques for silicon microsensors

Amita Gupta, Ranvir Singh, Mahesh Kumar, Amir Ahmad

Research output: Contribution to journalConference articlepeer-review

1 Citation (Scopus)


In this paper anodic bonding between Si and glass substrate has been investigated in detail. Thermal Bonding of Si to glass using a thin metallic intermediate layer has also been demonstrated. These processes have potential applications for microsensor fabrication and packaging that require low-temperature processing at the wafer level and good bonding strength.

Original languageEnglish
Pages (from-to)519-522
Number of pages4
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4746 I
Publication statusPublished - 2002
Externally publishedYes
EventPhysics of Semiconductor Devices - Delhi, India
Duration: Dec 11 2001Dec 15 2001

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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