@inproceedings{d1ad9256a97042d0b5e89accad1f929c,
title = "Comparative performance investigation between double-layered wavy and zig-zag microchannel heatsink for effective cooling of concentrated photovoltaic cells",
abstract = "This study reports the comparative investigation on the performance of double layered microchannel heatsinks for effective cooling of concentrated photovoltaic cells. The main aim is to find the best performance of fluid flow and heat transfer characteristics in a heatsink. Three different types of double -layered microchannel heatsinks (DL-MCHS); straight, wavy and zig-zag with counter current flow arrangement is studied. The mathematical models are solved using continuity, Navier-stokes and energy equations. Fluent module of ANSYS Workbench is utilized for solving the models. This study incorporates water being used as the coolant with laminar flow regime operating within the Reynolds number range of 50 to 1500. Two distinct characteristic parameters mainly thermal resistance and pumping power are identified and evaluated for determining the performance of the microchannel heatsinks. Wavy DL-MCHS proves to be dominant in terms of obtaining a better thermal and fluid flow performance when compared to zig-zag and straight DL-MCHS.",
keywords = "ANSYS, CPV cells, microchannel, wavy, zig-zag",
author = "Dinumol Varghese and Fadi Alnaimat and Bobby Mathew",
note = "Funding Information: Authors acknowledge support from National Water and Energy Center (NWEC) at UAEU for providing the computational facilities for completing this work. Publisher Copyright: {\textcopyright} 2022 IEEE.; 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022 ; Conference date: 31-05-2022 Through 03-06-2022",
year = "2022",
doi = "10.1109/iTherm54085.2022.9899561",
language = "English",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
publisher = "IEEE Computer Society",
booktitle = "Proceedings of the 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022",
}
