Cooling of a stacked multichip module - Tests and validations
- X. Y. Chen
- , K. C. Toh
- , J. C. Chai
- , T. N. Wong
- , D. Pinjala
- , O. K. Navas
- , Ganesh
- , Hengyun Zhang
- , V. Kripesh
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2
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(Scopus)