Abstract
We have developed a modeling tool that integrates optical, cost, thermal, mechanical, and solder models under a common user interface. The models are connected together to allow trade-off studies between parameters existing within different models. We have applied the integrated models to a family of optical interconnect modules. In this paper we will show how the integrated models can help the users design, as well as understand tradeoffs, in optical modules.
Original language | English |
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Pages (from-to) | 83-96 |
Number of pages | 14 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 3289 |
DOIs | |
Publication status | Published - Dec 1 1998 |
Event | Micro-Optics Integration and Assemblies - San Jose, CA, United States Duration: Jan 29 1998 → Jan 30 1998 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering