COUPLE: An integrated model for optical interconnect modules

R. Brian Hooker, Nuri Delen, Adam Fedor, Matthew Ball, J. S. Wu, Saeed Hareb, T. H. Ju, Y. C. Lee, Charles W. Stirk

Research output: Contribution to journalConference articlepeer-review

Abstract

We have developed a modeling tool that integrates optical, cost, thermal, mechanical, and solder models under a common user interface. The models are connected together to allow trade-off studies between parameters existing within different models. We have applied the integrated models to a family of optical interconnect modules. In this paper we will show how the integrated models can help the users design, as well as understand tradeoffs, in optical modules.

Original languageEnglish
Pages (from-to)83-96
Number of pages14
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3289
DOIs
Publication statusPublished - 1998
EventMicro-Optics Integration and Assemblies - San Jose, CA, United States
Duration: Jan 29 1998Jan 30 1998

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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