@inproceedings{ae6e1322974647c4b24b761dc14b1ffc,
title = "Direct liquid cooling of a stacked multichip module",
abstract = "With the advances in microfabrication techniques and high performance chips, the heat flux from electronic components is reaching a point where air-cooling is unlikely to meet the cooling requirements for future generation computer chips. Direct single-phase liquid cooling of a stacked multichip module using FC-77 is examined in this paper. Three-dimensional numerical simulation is conducted to investigate the flow and the conjugated convection-conduction heat transfer in the cooling structure. The effects of the top clearance, the side clearance, flow rate, heating arrangement on the maximum chip temperature and velocity distribution are presented.",
author = "Chen, {X. Y.} and Toh, {K. C.} and Chai, {J. C.} and D. Pinjala",
note = "Publisher Copyright: {\textcopyright} 2002 IEEE.; 4th Electronics Packaging Technology Conference, EPTC 2002 ; Conference date: 10-12-2002 Through 12-12-2002",
year = "2002",
doi = "10.1109/EPTC.2002.1185702",
language = "English",
series = "Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "380--384",
editor = "Iyer, {Mahadevan K.} and Toh, {Kok Chuan} and Charles Lee",
booktitle = "Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002",
}