Effect of reaction temperature on conversion and thermal properties of polyamide hot-melt adhesives

Chemical Engineering

• Polyamide 100%
• Dimer 50%
• Polymerization 25%
• Ethylene 25%
• Phosphoric Acid 25%

Keyphrases

• Heat of Fusion 40%
• Weighted Product 20%
• Dimer Acid 20%
• Empirical Parameters 20%
• Melting Heat 20%
• Number Average Molecular Weight 20%
• C36 Dimer Acid 20%
• Free Amine 20%
• Preheating Process 20%
• Empirical Parameter Estimation 20%

Engineering

• Dimer Acid 50%
• Final Product 50%
• Number Average Molecular Weight 25%
• Excess Amount 25%