TY - GEN
T1 - Efficient techniques for BGA solder joint identification in low resolution X-ray images
AU - Laghari, Mohammad Shakeel
AU - Hijer, Raed
AU - Khuwaja, Gulzar Ali
PY - 2011/6/9
Y1 - 2011/6/9
N2 - The benefits of X-ray inspection are broad in scope due to the ability of X-rays to see through packages including: encapsulation, heat sinks, and metallic shielding to reveal obscured connections and identify potential quality nondestructive issues. X-ray inspection is particularly beneficial to applications that involve advanced packaging technologies such as Ball Grid Array (BGA). This paper proposes a method that relies on an image processing and computer vision technique that detects each ball of the X-ray image of BGA chip and flags the suspect balls for further evaluation and rework. It makes use of the basic geometric distinction between a circle (perfect solder ball) and an ellipse (balls with reshaped solder joint). Thus making it easier for the casual user to identify the suspect areas (solder joints) for further evaluation.
AB - The benefits of X-ray inspection are broad in scope due to the ability of X-rays to see through packages including: encapsulation, heat sinks, and metallic shielding to reveal obscured connections and identify potential quality nondestructive issues. X-ray inspection is particularly beneficial to applications that involve advanced packaging technologies such as Ball Grid Array (BGA). This paper proposes a method that relies on an image processing and computer vision technique that detects each ball of the X-ray image of BGA chip and flags the suspect balls for further evaluation and rework. It makes use of the basic geometric distinction between a circle (perfect solder ball) and an ellipse (balls with reshaped solder joint). Thus making it easier for the casual user to identify the suspect areas (solder joints) for further evaluation.
KW - BGA
KW - Solder joints
KW - X-ray inspection techniques
KW - computer vision
KW - shape analysis
UR - http://www.scopus.com/inward/record.url?scp=79957992406&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79957992406&partnerID=8YFLogxK
U2 - 10.1109/IEEEGCC.2011.5752465
DO - 10.1109/IEEEGCC.2011.5752465
M3 - Conference contribution
AN - SCOPUS:79957992406
SN - 9781612841199
T3 - 2011 IEEE GCC Conference and Exhibition, GCC 2011
SP - 128
EP - 131
BT - 2011 IEEE GCC Conference and Exhibition, GCC
T2 - 2011 IEEE GCC Conference and Exhibition, GCC 2011
Y2 - 19 February 2011 through 22 February 2011
ER -