Efficient techniques for BGA solder joint identification in low resolution X-ray images

Mohammad Shakeel Laghari, Raed Hijer, Gulzar Ali Khuwaja

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

The benefits of X-ray inspection are broad in scope due to the ability of X-rays to see through packages including: encapsulation, heat sinks, and metallic shielding to reveal obscured connections and identify potential quality nondestructive issues. X-ray inspection is particularly beneficial to applications that involve advanced packaging technologies such as Ball Grid Array (BGA). This paper proposes a method that relies on an image processing and computer vision technique that detects each ball of the X-ray image of BGA chip and flags the suspect balls for further evaluation and rework. It makes use of the basic geometric distinction between a circle (perfect solder ball) and an ellipse (balls with reshaped solder joint). Thus making it easier for the casual user to identify the suspect areas (solder joints) for further evaluation.

Original languageEnglish
Title of host publication2011 IEEE GCC Conference and Exhibition, GCC
Pages128-131
Number of pages4
DOIs
Publication statusPublished - Jun 9 2011
Event2011 IEEE GCC Conference and Exhibition, GCC 2011 - Dubai, United Arab Emirates
Duration: Feb 19 2011Feb 22 2011

Publication series

Name2011 IEEE GCC Conference and Exhibition, GCC 2011

Other

Other2011 IEEE GCC Conference and Exhibition, GCC 2011
Country/TerritoryUnited Arab Emirates
CityDubai
Period2/19/112/22/11

Keywords

  • BGA
  • Solder joints
  • X-ray inspection techniques
  • computer vision
  • shape analysis

ASJC Scopus subject areas

  • Hardware and Architecture
  • Signal Processing
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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