TY - GEN
T1 - Electrodeposition of Zn alloys with Cu and Sn from citrate electrolytes
AU - Al Zahmi, Salem
AU - Podlaha, E. J.
N1 - Publisher Copyright:
© The Electrochemical Society.
PY - 2015
Y1 - 2015
N2 - The effect of Zn concentration on the electrodeposition of Zn, CuZn, SnZn, and CuSnZn was investigated using an upside down rotating disk electrode at pH 2. At a constant potential the alloys were both Cu-or Sn-rich at low Zn(II) ion electrolyte concentration and then jumped to Zn-rich at higher Zn (II) ion electrolyte concentration. The effect of codepositing Zn with Cu (or Sn) on the reaction order of Zn was studied by varying the Zn concentration in the electrolyte. A first order reaction order of Zn was found when Zn was singly deposited, but to capture the influence of the alloys the solid state activity was found to play an important role in the Tafel rate expression. When all three elements were present in the electrolyte at equimolar concentration the amount of Zn was between 18 - 44 wt %, in contrast to the upper and lower limits found with the binary alloys.
AB - The effect of Zn concentration on the electrodeposition of Zn, CuZn, SnZn, and CuSnZn was investigated using an upside down rotating disk electrode at pH 2. At a constant potential the alloys were both Cu-or Sn-rich at low Zn(II) ion electrolyte concentration and then jumped to Zn-rich at higher Zn (II) ion electrolyte concentration. The effect of codepositing Zn with Cu (or Sn) on the reaction order of Zn was studied by varying the Zn concentration in the electrolyte. A first order reaction order of Zn was found when Zn was singly deposited, but to capture the influence of the alloys the solid state activity was found to play an important role in the Tafel rate expression. When all three elements were present in the electrolyte at equimolar concentration the amount of Zn was between 18 - 44 wt %, in contrast to the upper and lower limits found with the binary alloys.
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U2 - 10.1149/06930.0001ecst
DO - 10.1149/06930.0001ecst
M3 - Conference contribution
AN - SCOPUS:84959518504
T3 - ECS Transactions
SP - 1
EP - 7
BT - Novel Design and Electrodeposition Modalities 2
A2 - Podlaha, E. J.
A2 - Huang, Q.
PB - Electrochemical Society Inc.
T2 - Symposium on Novel Design and Electrodeposition Modalities 2 - 228th ECS Meeting
Y2 - 11 October 2015 through 15 October 2015
ER -