TY - JOUR
T1 - Evolution and Analysis of GaN GAA FET Induced High-K Spacer Wrapped Gate Underlap for Superfast Circuitry and RF Applications
AU - Singh, Sneha
AU - Devi, Priya
AU - Dhar, Rudra Sankar
AU - Hussein, Mousa I.
AU - Awwad, Falah
N1 - Publisher Copyright:
© 2013 IEEE.
PY - 2025
Y1 - 2025
N2 - Gallium Nitride (GaN) Gate-All-Around (GAA) FETs are developed to be promising candidates for high-frequency, superfast circuitry and RF applications mainly due to their superior electron mobility and wide bandgap. A variety of GaN GAA FETs are developed incorporating gate underlap, spacer technology and source/drain engineering. A comprehensive analysis of DC and AC/RF performance parameters of high-k spacer-wrapped underlap-induced GaN GAA FETs with source and drain enlargements are attained. The impact of this spacer engineering on threshold voltage (Vth), drain-induced barrier lowering (DIBL), subthreshold swing (SS), ON-current (IOn), leakage current (IOff), and switching speed (IOn/IOff) are systematically evaluated. It is inevitably determined that integrating a high-K spacer substantially improves electrostatic control, thereby mitigates short-channel effects while achieve a near ideal SS of ~62 mV/decade. A refined underlap design with high-k wrapping effectively subdues fringing field effects by reducing parasitic capacitances and resistances acquiring cut-off frequency of ~7.2 THz, improves AC performances. The underlap region suppresses DIBL, maintaining excellent gate control while achieving a higher IOn/IOff ratio of ~ 19 × 108 instigating development of the novel device for superfast circuitry applications. The analysis is calibrated and validated with experimentally fabricated devices while Vth is analytically modelled. Comparison with existing research and proposed IRDS 2028 of 1.5 nm technology node shows the underlap-induced GaN GAA FET is advantageous, highlighting its effectiveness in reducing power dissipation, and enhancing switching performance. These findings confirm the design is well-suited for next-generation low-power, high-performance, superfast circuitry and RF applications offering superior energy efficiency and reliability in ultra-scaled transistor architectures.
AB - Gallium Nitride (GaN) Gate-All-Around (GAA) FETs are developed to be promising candidates for high-frequency, superfast circuitry and RF applications mainly due to their superior electron mobility and wide bandgap. A variety of GaN GAA FETs are developed incorporating gate underlap, spacer technology and source/drain engineering. A comprehensive analysis of DC and AC/RF performance parameters of high-k spacer-wrapped underlap-induced GaN GAA FETs with source and drain enlargements are attained. The impact of this spacer engineering on threshold voltage (Vth), drain-induced barrier lowering (DIBL), subthreshold swing (SS), ON-current (IOn), leakage current (IOff), and switching speed (IOn/IOff) are systematically evaluated. It is inevitably determined that integrating a high-K spacer substantially improves electrostatic control, thereby mitigates short-channel effects while achieve a near ideal SS of ~62 mV/decade. A refined underlap design with high-k wrapping effectively subdues fringing field effects by reducing parasitic capacitances and resistances acquiring cut-off frequency of ~7.2 THz, improves AC performances. The underlap region suppresses DIBL, maintaining excellent gate control while achieving a higher IOn/IOff ratio of ~ 19 × 108 instigating development of the novel device for superfast circuitry applications. The analysis is calibrated and validated with experimentally fabricated devices while Vth is analytically modelled. Comparison with existing research and proposed IRDS 2028 of 1.5 nm technology node shows the underlap-induced GaN GAA FET is advantageous, highlighting its effectiveness in reducing power dissipation, and enhancing switching performance. These findings confirm the design is well-suited for next-generation low-power, high-performance, superfast circuitry and RF applications offering superior energy efficiency and reliability in ultra-scaled transistor architectures.
KW - GaN GAA FET
KW - dc and ac performance
KW - high-k underlap
KW - nano-scaled transistor
KW - superfast circuitry
UR - https://www.scopus.com/pages/publications/105015889320
UR - https://www.scopus.com/pages/publications/105015889320#tab=citedBy
U2 - 10.1109/ACCESS.2025.3608819
DO - 10.1109/ACCESS.2025.3608819
M3 - Article
AN - SCOPUS:105015889320
SN - 2169-3536
VL - 13
SP - 160221
EP - 160237
JO - IEEE Access
JF - IEEE Access
ER -