Abstract
An integrated model has been established to study the thermal fatigue behavior of solder joints in plastic ball grid array (PBGA) assemblies. The solder joint's profile was calculated first. Then, an 'equivalent beam' macro model combined with a 3-D micro model were used to calculate the viscoplastic strain energy density of the most susceptible solder joint under temperature cycles. With this energy density, the solder joint fatigue life could be estimated by correlations published in literature. This method can predict the location of the first joint broken, which is found to be always under the corner of the silicon chip. A 72-I/O and a 225-I/O package were studied using this model. I/O number, chip size, substrate thickness and solder volume were varied to see how each affects the reliability of the solder joint under temperature cycles. The results show that change in I/O number outside the silicon chip area has negligible effect, but changes in the other three parameters have substantial effect on the reliability of the solder joint connection.
| Original language | English |
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| Pages | 83-89 |
| Number of pages | 7 |
| Publication status | Published - 1995 |
| Event | Proceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition - San Francisco, CA, USA Duration: Nov 12 1995 → Nov 17 1995 |
Other
| Other | Proceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition |
|---|---|
| City | San Francisco, CA, USA |
| Period | 11/12/95 → 11/17/95 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering