TY - JOUR
T1 - Liquid cooling of microelectronic chips using MEMS heat sink
T2 - Thermohydraulic characteristics of wavy microchannels with pin-fins
AU - Alkhazaleh, Anas
AU - Alnaimat, Fadi
AU - Selim, Mohamed
AU - Mathew, Bobby
N1 - Funding Information:
The authors acknowledge significant support received from Dr. Andrew Lingley (andrew.lingley@montana.edu) of Montana Microfabrication Facility of Montana State University, Bozeman, Montana, USA, a member of the National Nanotechnology Coordinated Infrastructure (NNCI), which is supported by the National Science Foundation (NSF; Grant# ECCS-2025391 ) in converting the design of the heat sinks into prototypes. The authors also acknowledge support from National Water and Energy Center (NWEC) of UAEU for providing computational resources for executing this work.
Publisher Copyright:
© 2023 The Author(s)
PY - 2023/5
Y1 - 2023/5
N2 - This article details the mathematical modeling and experimental validation of a liquid based MEMS heat sink using wavy microchannels with pin-fins for cooling of microelectronic chips with heat flux of 1000 kW/m2. The characteristics of the heat sink are evaluated using thermal resistance, pumping power, Poiseuille number, and Nusselt number. Investigations are done for Reynolds number varying from 250 to 1500 for understanding the working of the proposed MEMS heat sink as well as to evaluate the contribution of different geometric parameters (amplitude, wavelength, hydraulic diameter, and diameter of pin-fins) on its performance. Over this Reynolds number range, the thermal resistance of MEMS heat sinks using wavy microchannel with pin-fins is 7–10% lower than that of MEMS heat sinks using wavy microchannel while the corresponding pumping power increased by 66–148%; at the lowest Reynolds number, the proposed MEMS heat sink reduced the maximum substrate temperature by 5 °C compared with that of MEMS heat sinks employing wavy microchannels and at the highest Reynolds number, this temperature difference is 2 °C. The influence of geometric parameters is the highest at the low Reynolds number and their influence reduces with rise in Reynolds number. It is established based on the studies that increase in amplitude, hydraulic diameter, and diameter of pin-fins lead to decrease in thermal resistance and rise in pumping power; however, rise in wavelength raises and decreases the thermal resistance and pumping power, respectively. The contribution of hydraulic diameter and wavelength to thermal resistance and pumping power is greater than that of amplitude and diameter of pin-fins. The average Poiseuille number and Nusselt number associated with many combinations of dimensions of MEMS heat sinks using wavy microchannels with pin-fins are provided in this work and this information is particularly useful for designers of the proposed MEMS heat sink.
AB - This article details the mathematical modeling and experimental validation of a liquid based MEMS heat sink using wavy microchannels with pin-fins for cooling of microelectronic chips with heat flux of 1000 kW/m2. The characteristics of the heat sink are evaluated using thermal resistance, pumping power, Poiseuille number, and Nusselt number. Investigations are done for Reynolds number varying from 250 to 1500 for understanding the working of the proposed MEMS heat sink as well as to evaluate the contribution of different geometric parameters (amplitude, wavelength, hydraulic diameter, and diameter of pin-fins) on its performance. Over this Reynolds number range, the thermal resistance of MEMS heat sinks using wavy microchannel with pin-fins is 7–10% lower than that of MEMS heat sinks using wavy microchannel while the corresponding pumping power increased by 66–148%; at the lowest Reynolds number, the proposed MEMS heat sink reduced the maximum substrate temperature by 5 °C compared with that of MEMS heat sinks employing wavy microchannels and at the highest Reynolds number, this temperature difference is 2 °C. The influence of geometric parameters is the highest at the low Reynolds number and their influence reduces with rise in Reynolds number. It is established based on the studies that increase in amplitude, hydraulic diameter, and diameter of pin-fins lead to decrease in thermal resistance and rise in pumping power; however, rise in wavelength raises and decreases the thermal resistance and pumping power, respectively. The contribution of hydraulic diameter and wavelength to thermal resistance and pumping power is greater than that of amplitude and diameter of pin-fins. The average Poiseuille number and Nusselt number associated with many combinations of dimensions of MEMS heat sinks using wavy microchannels with pin-fins are provided in this work and this information is particularly useful for designers of the proposed MEMS heat sink.
KW - Heat sink
KW - Heat transfer enhancement
KW - Liquid cooling
KW - Pumping power
KW - Thermal resistance
KW - Wavy microchannel
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U2 - 10.1016/j.ijft.2023.100313
DO - 10.1016/j.ijft.2023.100313
M3 - Article
AN - SCOPUS:85148951178
SN - 2666-2027
VL - 18
JO - International Journal of Thermofluids
JF - International Journal of Thermofluids
M1 - 100313
ER -