Localized electrochemical deposition of copper microstructures (I): Modeling of structure formation

R. A. Said, M. Hussein

Research output: Contribution to conferencePaperpeer-review


This paper presents the simulation of shape formation of copper microstructures fabricated by localized electrochemical deposition technology. The simulation procedures utilize electric field calculation by a boundary element method and a progressive boundary update approach to determine the profiles of deposition evolution. The calculation procedures are applied to simulate the shape formation of electrochemically deposited copper columns microstructures. Simulation results are compared against images of base development of copper columns obtained at different formation stages during deposition process. Deposition profiles obtained from both the simulation procedures and images of deposition evolution are in agreement, thus demonstrating the validity of proposed simulation procedures. Obtained results also demonstrate the usefulness of simulation procedures as an analysis tool to better understand the dynamics and factors influencing shape formation in localized electrochemical deposition.

Original languageEnglish
Number of pages9
Publication statusPublished - 2001

ASJC Scopus subject areas

  • General Engineering


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