Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks

M. Hamdan; D. Cytrynowicz; P. Medis; A. Shuja; F. M. Gerner; H. T. Henderson; E. Golliher; K. Mellott; C. Moore

doi:10.1109/ITHERM.2002.1012492

Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks

M. Hamdan, D. Cytrynowicz, P. Medis, A. Shuja, F. M. Gerner, H. T. Henderson, E. Golliher, K. Mellott, C. Moore

Department of Mechanical and Aerospace Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

37 Citations (Scopus)

Abstract

This paper introduces a theoretical model for a Loop Heat Pipe (LHP) utilizing a coherent porous silicon (CPS) wick. The paper investigates the effects of different parameters on the performance of the LHP such as evaporator temperature, condenser temperature, total mass charge, wick thickness, porosity, and pore size. A LHP is a two-phase device with extremely high effective thermal conductivity that uses capillary forces developed inside its wicked evaporator to pump a working fluid through a closed loop. The loop heat pipe is developed to efficiently transport heat that is generated by a highly localized concentrated heat source and then to discharge this heat to a convenient sink. This device is urgently needed to cool electronic components, especially in space applications. The LHP has been modeled utilizing the conservation equations and thermodynamic cycle. The loop heat pipe cycle is presented on a T-s diagram. A direct relation is developed between the ratio of heat going for evaporation as well as heat leaking to the compensation chamber.

Original language	English
Title of host publication	ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Editors	Bahgat G. Sammakia, Yogendra K. Joshi, Ganesh Subbarayan, Cristina H. Amon, Koneru Ramakrishna, Sanjeev B. Sathe
Publisher	IEEE Computer Society
Pages	457-465
Number of pages	9
ISBN (Electronic)	0780371526
DOIs	https://doi.org/10.1109/ITHERM.2002.1012492
Publication status	Published - Jan 1 2002
Event	8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, United States Duration: May 30 2002 → Jun 1 2002

Publication series

Name	InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume	2002-January
ISSN (Print)	1936-3958

Other

Other	8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
Country/Territory	United States
City	San Diego
Period	5/30/02 → 6/1/02

Keywords

Electronic components
Equations
Fault location
Heat sinks
Pumps
Silicon
Space cooling
Temperature
Thermal conductivity
Thermal force

ASJC Scopus subject areas

Control and Systems Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/ITHERM.2002.1012492

Cite this

Hamdan, M., Cytrynowicz, D., Medis, P., Shuja, A., Gerner, F. M., Henderson, H. T., Golliher, E., Mellott, K., & Moore, C. (2002). Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks. In B. G. Sammakia, Y. K. Joshi, G. Subbarayan, C. H. Amon, K. Ramakrishna, & S. B. Sathe (Eds.), ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (pp. 457-465). Article 1012492 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2002-January). IEEE Computer Society. https://doi.org/10.1109/ITHERM.2002.1012492

Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks. / Hamdan, M.; Cytrynowicz, D.; Medis, P. et al.
ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. ed. / Bahgat G. Sammakia; Yogendra K. Joshi; Ganesh Subbarayan; Cristina H. Amon; Koneru Ramakrishna; Sanjeev B. Sathe. IEEE Computer Society, 2002. p. 457-465 1012492 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2002-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hamdan, M, Cytrynowicz, D, Medis, P, Shuja, A, Gerner, FM, Henderson, HT, Golliher, E, Mellott, K & Moore, C 2002, Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks. in BG Sammakia, YK Joshi, G Subbarayan, CH Amon, K Ramakrishna & SB Sathe (eds), ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems., 1012492, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, vol. 2002-January, IEEE Computer Society, pp. 457-465, 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002, San Diego, United States, 5/30/02. https://doi.org/10.1109/ITHERM.2002.1012492

Hamdan M, Cytrynowicz D, Medis P, Shuja A, Gerner FM, Henderson HT et al. Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks. In Sammakia BG, Joshi YK, Subbarayan G, Amon CH, Ramakrishna K, Sathe SB, editors, ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. IEEE Computer Society. 2002. p. 457-465. 1012492. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). doi: 10.1109/ITHERM.2002.1012492

Hamdan, M. ; Cytrynowicz, D. ; Medis, P. et al. / Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks. ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. editor / Bahgat G. Sammakia ; Yogendra K. Joshi ; Ganesh Subbarayan ; Cristina H. Amon ; Koneru Ramakrishna ; Sanjeev B. Sathe. IEEE Computer Society, 2002. pp. 457-465 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).

@inproceedings{80c1f15f66044824a0ad6f28ea8b54f7,

title = "Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks",

abstract = "This paper introduces a theoretical model for a Loop Heat Pipe (LHP) utilizing a coherent porous silicon (CPS) wick. The paper investigates the effects of different parameters on the performance of the LHP such as evaporator temperature, condenser temperature, total mass charge, wick thickness, porosity, and pore size. A LHP is a two-phase device with extremely high effective thermal conductivity that uses capillary forces developed inside its wicked evaporator to pump a working fluid through a closed loop. The loop heat pipe is developed to efficiently transport heat that is generated by a highly localized concentrated heat source and then to discharge this heat to a convenient sink. This device is urgently needed to cool electronic components, especially in space applications. The LHP has been modeled utilizing the conservation equations and thermodynamic cycle. The loop heat pipe cycle is presented on a T-s diagram. A direct relation is developed between the ratio of heat going for evaporation as well as heat leaking to the compensation chamber.",

keywords = "Electronic components, Equations, Fault location, Heat sinks, Pumps, Silicon, Space cooling, Temperature, Thermal conductivity, Thermal force",

author = "M. Hamdan and D. Cytrynowicz and P. Medis and A. Shuja and Gerner, {F. M.} and Henderson, {H. T.} and E. Golliher and K. Mellott and C. Moore",

year = "2002",

month = jan,

day = "1",

doi = "10.1109/ITHERM.2002.1012492",

language = "English",

series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",

publisher = "IEEE Computer Society",

pages = "457--465",

editor = "Sammakia, {Bahgat G.} and Joshi, {Yogendra K.} and Ganesh Subbarayan and Amon, {Cristina H.} and Koneru Ramakrishna and Sathe, {Sanjeev B.}",

booktitle = "ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems",

note = "8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 ; Conference date: 30-05-2002 Through 01-06-2002",

}

TY - GEN

T1 - Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks

AU - Hamdan, M.

AU - Cytrynowicz, D.

AU - Medis, P.

AU - Shuja, A.

AU - Gerner, F. M.

AU - Henderson, H. T.

AU - Golliher, E.

AU - Mellott, K.

AU - Moore, C.

PY - 2002/1/1

Y1 - 2002/1/1

N2 - This paper introduces a theoretical model for a Loop Heat Pipe (LHP) utilizing a coherent porous silicon (CPS) wick. The paper investigates the effects of different parameters on the performance of the LHP such as evaporator temperature, condenser temperature, total mass charge, wick thickness, porosity, and pore size. A LHP is a two-phase device with extremely high effective thermal conductivity that uses capillary forces developed inside its wicked evaporator to pump a working fluid through a closed loop. The loop heat pipe is developed to efficiently transport heat that is generated by a highly localized concentrated heat source and then to discharge this heat to a convenient sink. This device is urgently needed to cool electronic components, especially in space applications. The LHP has been modeled utilizing the conservation equations and thermodynamic cycle. The loop heat pipe cycle is presented on a T-s diagram. A direct relation is developed between the ratio of heat going for evaporation as well as heat leaking to the compensation chamber.

AB - This paper introduces a theoretical model for a Loop Heat Pipe (LHP) utilizing a coherent porous silicon (CPS) wick. The paper investigates the effects of different parameters on the performance of the LHP such as evaporator temperature, condenser temperature, total mass charge, wick thickness, porosity, and pore size. A LHP is a two-phase device with extremely high effective thermal conductivity that uses capillary forces developed inside its wicked evaporator to pump a working fluid through a closed loop. The loop heat pipe is developed to efficiently transport heat that is generated by a highly localized concentrated heat source and then to discharge this heat to a convenient sink. This device is urgently needed to cool electronic components, especially in space applications. The LHP has been modeled utilizing the conservation equations and thermodynamic cycle. The loop heat pipe cycle is presented on a T-s diagram. A direct relation is developed between the ratio of heat going for evaporation as well as heat leaking to the compensation chamber.

KW - Electronic components

KW - Equations

KW - Fault location

KW - Heat sinks

KW - Pumps

KW - Silicon

KW - Space cooling

KW - Temperature

KW - Thermal conductivity

KW - Thermal force

UR - http://www.scopus.com/inward/record.url?scp=84950131849&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84950131849&partnerID=8YFLogxK

U2 - 10.1109/ITHERM.2002.1012492

DO - 10.1109/ITHERM.2002.1012492

M3 - Conference contribution

AN - SCOPUS:84950131849

T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

SP - 457

EP - 465

BT - ITHERM 2002 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

A2 - Sammakia, Bahgat G.

A2 - Joshi, Yogendra K.

A2 - Subbarayan, Ganesh

A2 - Amon, Cristina H.

A2 - Ramakrishna, Koneru

A2 - Sathe, Sanjeev B.

PB - IEEE Computer Society

T2 - 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002

Y2 - 30 May 2002 through 1 June 2002

ER -

Loop heat pipe (LHP) development by utilizing coherent porous silicon (CPS) wicks

Abstract

Publication series

Other

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this