Microchannel heat sink for thermal management of concentrated photovoltaic cells

Dinumol Varghese, Ahmed Sefelnasr, Mohsen Sherif, Fadi Alnaimat, Bobby Mathew

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This article conceptualizes a single-phase microchannel heat sink for thermal management of concentrated photovoltaic cells; details of the model-based parametric study that is carried out on the heat sink is also detailed in this article. The heat sink consists of multiple serpentine microchannels. The mathematical model consists of continuity equation, Navier-Stokes equations and energy equations. Fluent module of Ansys Workbench is used for solving the model. The performance of the device is quantified in terms two metrics such as thermal resistance and pumping power. Studies are done for Reynolds number ranging from 100 to 1250. It is observed that increase in Reynolds number decreases the thermal resistance while increasing the pumping power irrespective of the geometric parameters of the heat sink. Decrease in hydraulic diameter of the microchannel reduces the thermal resistance while increasing the pumping power. Increase in the length segment of the serpentine microchannel increases and decreases the thermal resistance and pumping power, respectively. With increase in the offset width of the serpentine microchannel the thermal resistance and pumping power decreases and increases, respectively.

Original languageEnglish
Title of host publicationProceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791885505
Publication statusPublished - 2021
EventASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021 - Virtual, Online
Duration: Oct 26 2021Oct 28 2021

Publication series

NameProceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021

Conference

ConferenceASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021
CityVirtual, Online
Period10/26/2110/28/21

Keywords

  • Concentrated photovoltaic cells
  • Heat sink
  • Pumping power
  • Serpentine microchannel
  • Thermal management
  • Thermal resistance

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Fingerprint

Dive into the research topics of 'Microchannel heat sink for thermal management of concentrated photovoltaic cells'. Together they form a unique fingerprint.

Cite this