Modeling of smart compliant electro-active polymer actuator

S. Soulimane, M. Al Ahmad, M. Matmat, H. Camon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The electro-active polymers smart materials are typically characterized by their large strain, low modulus, and high compliance which make them suitable and of efficient use in area of actuation. Dielectric electroactive polymer (DEAP) actuators combine high energy density with large displacements, low power consumption and fast response time, which make them very attractive for a wide variety of applications, both on the macro- and micro-scale. The design and fabrication of a proper actuator for micro pump and micro mirror applications requires an explicit knowledge of the involving materials as well as the miniaturizations techniques. The prediction of the mechanical behavior when dc bias is applied is often performed thought the help of suitable multi-physics tools. These tools generally based on the finite element analysis algorithms. The results of these simulations will provide quantitative characterizations concerning the actuation spatial resolution, and also allows optimizing the fabrication process in terms of materials and integrations steps. The scope of this work is to shows how a multi-physics tool such as CoventorWare is used to anticipate the electromechanical behaviour of micro actuator comprising a PDMS material for actuation. The simulation investigates the electromechanical coupling in the dielectric elastomer actuators.

Original languageEnglish
Title of host publicationEuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
DOIs
Publication statusPublished - 2008
Externally publishedYes
EventEuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Freiburg im Breisgau, Germany
Duration: Apr 20 2008Apr 23 2008

Publication series

NameEuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems

Other

OtherEuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems
Country/TerritoryGermany
CityFreiburg im Breisgau
Period4/20/084/23/08

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

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