Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications

Thamer Khalif Salem, Ferina Saati Khosroshahi, Mehmet Arık, Mohammad O. Hamdan, Mete Budakli

Research output: Contribution to journalReview articlepeer-review

11 Citations (Scopus)

Abstract

Thermal management is one of the main issues for electronics cooling especially for tightly packaged PCBs that experience local heat generation. Thus, theoretical and experimental investigations have been conducted to predict thermal performance of a novel heat-pipe-embedded-PCB. First, plain heat-pipe is experimentally tested under various inclination angles and validated by theoretical and numerical calculations. Flattened heat-pipes have been embedded into PCB prototypes made of polymer and aluminum and have been tested for similar experimental parameters; they have shown a decrease in Rtotal compared with conventional heat pipe. Accordingly, reduction of Rtotal approximately 50% is achieved for both embedded PCB prototypes.

Original languageEnglish
Pages (from-to)1-13
Number of pages13
JournalExperimental Heat Transfer
Volume32
Issue number1
DOIs
Publication statusPublished - Jan 2 2019
Externally publishedYes

Keywords

  • Heat pipe
  • electronics cooling
  • embedded heat pipe
  • printed circuit board
  • thermal conductivity

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Instrumentation
  • Electrical and Electronic Engineering

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