TY - JOUR
T1 - Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications
AU - Salem, Thamer Khalif
AU - Khosroshahi, Ferina Saati
AU - Arık, Mehmet
AU - Hamdan, Mohammad O.
AU - Budakli, Mete
N1 - Funding Information:
This work was supported by the Turkish Ministry of Science and Technology; [01464.STZ.2012-2]; Istanbul Development Agency; [ISTKABIL26]; [ISTKATR10/15/YNK/0029]. The funding for this project was provided by the Turkish Ministry of Science and Technology under the grant number 01464.STZ.2012-2. This work was supported by the Istanbul Development Agency under the contract number ISTKABIL26 and ISTKATR10/15/YNK/0029. The authors would like to thank FARBA Corporation for their support in building the experimental setup.
Funding Information:
The funding for this project was provided by the Turkish Ministry of Science and Technology under the grant number 01464.STZ.2012-2. This work was supported by the Istanbul Development Agency under the contract number ISTKABIL26 and ISTKATR10/15/YNK/0029. The authors would like to thank FARBA Corporation for their support in building the experimental setup.
Publisher Copyright:
© 2017, © 2017 Taylor & Francis.
PY - 2019/1/2
Y1 - 2019/1/2
N2 - Thermal management is one of the main issues for electronics cooling especially for tightly packaged PCBs that experience local heat generation. Thus, theoretical and experimental investigations have been conducted to predict thermal performance of a novel heat-pipe-embedded-PCB. First, plain heat-pipe is experimentally tested under various inclination angles and validated by theoretical and numerical calculations. Flattened heat-pipes have been embedded into PCB prototypes made of polymer and aluminum and have been tested for similar experimental parameters; they have shown a decrease in Rtotal compared with conventional heat pipe. Accordingly, reduction of Rtotal approximately 50% is achieved for both embedded PCB prototypes.
AB - Thermal management is one of the main issues for electronics cooling especially for tightly packaged PCBs that experience local heat generation. Thus, theoretical and experimental investigations have been conducted to predict thermal performance of a novel heat-pipe-embedded-PCB. First, plain heat-pipe is experimentally tested under various inclination angles and validated by theoretical and numerical calculations. Flattened heat-pipes have been embedded into PCB prototypes made of polymer and aluminum and have been tested for similar experimental parameters; they have shown a decrease in Rtotal compared with conventional heat pipe. Accordingly, reduction of Rtotal approximately 50% is achieved for both embedded PCB prototypes.
KW - Heat pipe
KW - electronics cooling
KW - embedded heat pipe
KW - printed circuit board
KW - thermal conductivity
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U2 - 10.1080/08916152.2017.1397818
DO - 10.1080/08916152.2017.1397818
M3 - Review article
AN - SCOPUS:85035078973
SN - 0891-6152
VL - 32
SP - 1
EP - 13
JO - Experimental Heat Transfer
JF - Experimental Heat Transfer
IS - 1
ER -