Performance Characteristics of MEMS Heat Sinks Using Zig-Zag Microchannel with Semi-Circular Sidewall Ribs

Fadi Alnaimat; Saeed Al Nuaimi; Bobby Mathew

doi:10.1109/EPTC59621.2023.10457565

Performance Characteristics of MEMS Heat Sinks Using Zig-Zag Microchannel with Semi-Circular Sidewall Ribs

Fadi Alnaimat, Saeed Al Nuaimi, Bobby Mathew

Department of Mechanical and Aerospace Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This work details a simulation based on understanding the thermo hydraulic characteristics of a MEMS heat sink using zig-zag microchannels with semi-circular sidewall ribs. The performance of the MEMS heat sink is characterized in terms of thermal resistance and pressure drop. It is identified in this study that the presence of sidewall ribs improves the performance of the MEMS heat sink in comparison with the MEMS heat sinks using straight microchannels. Studies are done for Reynolds number ranging from 250 to 1000 in increments of 250. This study considers the influence of diameter of the semi-circular ribs, orientation of the zig-zag microchannels, hydraulic diameter of the zig-zag microchannel, and number of units of the zig-zag microchannel. It is observed that increase in orientation, number of units, and diameter of the semi-circular ribs lead to decrease and increase in thermal resistance and pressure drop, respectively.

Original language	English
Title of host publication	Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023
Editors	Andrew Tay, King Jien Chui, Yeow Kheng Lim, Chuan Seng Tan, Sunmi Shin
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1043-1046
Number of pages	4
ISBN (Electronic)	9798350329575
DOIs	https://doi.org/10.1109/EPTC59621.2023.10457565
Publication status	Published - 2023
Event	25th Electronics Packaging Technology Conference, EPTC 2023 - Singapore, Singapore Duration: Dec 5 2023 → Dec 8 2023

Publication series

Name	Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023

Conference

Conference	25th Electronics Packaging Technology Conference, EPTC 2023
Country/Territory	Singapore
City	Singapore
Period	12/5/23 → 12/8/23

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Instrumentation
Atomic and Molecular Physics, and Optics

Access to Document

10.1109/EPTC59621.2023.10457565

Cite this

Alnaimat, F., Al Nuaimi, S., & Mathew, B. (2023). Performance Characteristics of MEMS Heat Sinks Using Zig-Zag Microchannel with Semi-Circular Sidewall Ribs. In A. Tay, K. J. Chui, Y. K. Lim, C. S. Tan, & S. Shin (Eds.), Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023 (pp. 1043-1046). (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC59621.2023.10457565

Performance Characteristics of MEMS Heat Sinks Using Zig-Zag Microchannel with Semi-Circular Sidewall Ribs. / Alnaimat, Fadi ; Al Nuaimi, Saeed ; Mathew, Bobby.
Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. ed. / Andrew Tay; King Jien Chui; Yeow Kheng Lim; Chuan Seng Tan; Sunmi Shin. Institute of Electrical and Electronics Engineers Inc., 2023. p. 1043-1046 (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Alnaimat, F , Al Nuaimi, S & Mathew, B 2023, Performance Characteristics of MEMS Heat Sinks Using Zig-Zag Microchannel with Semi-Circular Sidewall Ribs. in A Tay, KJ Chui, YK Lim, CS Tan & S Shin (eds), Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023, Institute of Electrical and Electronics Engineers Inc., pp. 1043-1046, 25th Electronics Packaging Technology Conference, EPTC 2023, Singapore, Singapore, 12/5/23. https://doi.org/10.1109/EPTC59621.2023.10457565

Alnaimat F , Al Nuaimi S , Mathew B. Performance Characteristics of MEMS Heat Sinks Using Zig-Zag Microchannel with Semi-Circular Sidewall Ribs. In Tay A, Chui KJ, Lim YK, Tan CS, Shin S, editors, Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 1043-1046. (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023). doi: 10.1109/EPTC59621.2023.10457565

Alnaimat, Fadi ; Al Nuaimi, Saeed ; Mathew, Bobby. / Performance Characteristics of MEMS Heat Sinks Using Zig-Zag Microchannel with Semi-Circular Sidewall Ribs. Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023. editor / Andrew Tay ; King Jien Chui ; Yeow Kheng Lim ; Chuan Seng Tan ; Sunmi Shin. Institute of Electrical and Electronics Engineers Inc., 2023. pp. 1043-1046 (Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023).

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abstract = "This work details a simulation based on understanding the thermo hydraulic characteristics of a MEMS heat sink using zig-zag microchannels with semi-circular sidewall ribs. The performance of the MEMS heat sink is characterized in terms of thermal resistance and pressure drop. It is identified in this study that the presence of sidewall ribs improves the performance of the MEMS heat sink in comparison with the MEMS heat sinks using straight microchannels. Studies are done for Reynolds number ranging from 250 to 1000 in increments of 250. This study considers the influence of diameter of the semi-circular ribs, orientation of the zig-zag microchannels, hydraulic diameter of the zig-zag microchannel, and number of units of the zig-zag microchannel. It is observed that increase in orientation, number of units, and diameter of the semi-circular ribs lead to decrease and increase in thermal resistance and pressure drop, respectively.",

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AB - This work details a simulation based on understanding the thermo hydraulic characteristics of a MEMS heat sink using zig-zag microchannels with semi-circular sidewall ribs. The performance of the MEMS heat sink is characterized in terms of thermal resistance and pressure drop. It is identified in this study that the presence of sidewall ribs improves the performance of the MEMS heat sink in comparison with the MEMS heat sinks using straight microchannels. Studies are done for Reynolds number ranging from 250 to 1000 in increments of 250. This study considers the influence of diameter of the semi-circular ribs, orientation of the zig-zag microchannels, hydraulic diameter of the zig-zag microchannel, and number of units of the zig-zag microchannel. It is observed that increase in orientation, number of units, and diameter of the semi-circular ribs lead to decrease and increase in thermal resistance and pressure drop, respectively.

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Performance Characteristics of MEMS Heat Sinks Using Zig-Zag Microchannel with Semi-Circular Sidewall Ribs

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