Performance Characteristics of MEMS Heat Sinks Using Zig-Zag Microchannel with Semi-Circular Sidewall Ribs

Fadi Alnaimat, Saeed Al Nuaimi, Bobby Mathew

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work details a simulation based on understanding the thermo hydraulic characteristics of a MEMS heat sink using zig-zag microchannels with semi-circular sidewall ribs. The performance of the MEMS heat sink is characterized in terms of thermal resistance and pressure drop. It is identified in this study that the presence of sidewall ribs improves the performance of the MEMS heat sink in comparison with the MEMS heat sinks using straight microchannels. Studies are done for Reynolds number ranging from 250 to 1000 in increments of 250. This study considers the influence of diameter of the semi-circular ribs, orientation of the zig-zag microchannels, hydraulic diameter of the zig-zag microchannel, and number of units of the zig-zag microchannel. It is observed that increase in orientation, number of units, and diameter of the semi-circular ribs lead to decrease and increase in thermal resistance and pressure drop, respectively.

Original languageEnglish
Title of host publicationProceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023
EditorsAndrew Tay, King Jien Chui, Yeow Kheng Lim, Chuan Seng Tan, Sunmi Shin
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1043-1046
Number of pages4
ISBN (Electronic)9798350329575
DOIs
Publication statusPublished - 2023
Event25th Electronics Packaging Technology Conference, EPTC 2023 - Singapore, Singapore
Duration: Dec 5 2023Dec 8 2023

Publication series

NameProceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023

Conference

Conference25th Electronics Packaging Technology Conference, EPTC 2023
Country/TerritorySingapore
CitySingapore
Period12/5/2312/8/23

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Atomic and Molecular Physics, and Optics

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