Tenacious hardware trojans due to high temperature in middle tiers of 3-D ICs

Syed Rafay Hasan; Siraj Fulum Mossa; Omar Sayed Ahmed Elkeelany; Falah Awwad

doi:10.1109/MWSCAS.2015.7282148

Tenacious hardware trojans due to high temperature in middle tiers of 3-D ICs

Syed Rafay Hasan, Siraj Fulum Mossa, Omar Sayed Ahmed Elkeelany, Falah Awwad

Department of Electrical and Communication Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

19 Citations (Scopus)

Abstract

Hardware security is a major concern in the intellectual property (IP) centric integrated circuits (IC). 3-D IC design augments IP centric designs. However, 3-D ICs suffer from high temperatures in their middle tiers due to long heat dissipation paths. We anticipate that this problem would exacerbate the hardware security issues in 3-D ICs. Because, high temperature leads to undesired timing characteristics in ICs. In this paper we provide a detailed analysis on how these delay variations can lead to non-ideal behavior of control paths. It is demonstrated that a hardware intruder can leverage this phenomenon to trigger the payload, without requiring a separate triggering circuit. Our simulation results show that a state machine can lead to temporary glitches long enough to cause malfunctioning at temperatures of 87°C or above, under nominal frequencies. The overall area overhead of the payload compared to a very small Mod-3 counter is 6%.

Original language	English
Title of host publication	Midwest Symposium on Circuits and Systems
Publisher	Institute of Electrical and Electronics Engineers Inc.
Volume	2015-September
ISBN (Print)	9781467365574
DOIs	https://doi.org/10.1109/MWSCAS.2015.7282148
Publication status	Published - Sept 28 2015
Event	58th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2015 - Fort Collins, United States Duration: Aug 2 2015 → Aug 5 2015

Other

Other	58th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2015
Country/Territory	United States
City	Fort Collins
Period	8/2/15 → 8/5/15

Keywords

3-D IC
hardware Trojan
high temperature

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/MWSCAS.2015.7282148

Cite this

Tenacious hardware trojans due to high temperature in middle tiers of 3-D ICs. / Hasan, Syed Rafay; Mossa, Siraj Fulum; Elkeelany, Omar Sayed Ahmed et al.
Midwest Symposium on Circuits and Systems. Vol. 2015-September Institute of Electrical and Electronics Engineers Inc., 2015. 7282148.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hasan, SR, Mossa, SF, Elkeelany, OSA & Awwad, F 2015, Tenacious hardware trojans due to high temperature in middle tiers of 3-D ICs. in Midwest Symposium on Circuits and Systems. vol. 2015-September, 7282148, Institute of Electrical and Electronics Engineers Inc., 58th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2015, Fort Collins, United States, 8/2/15. https://doi.org/10.1109/MWSCAS.2015.7282148

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Tenacious hardware trojans due to high temperature in middle tiers of 3-D ICs

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Keywords

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