Transient two dimensional heat conduction by orthogonal collocation technique

P. Sangsurasak; D. A. Mitchell; M. Hossain

doi:10.1016/0735-1933(93)90067-6

Transient two dimensional heat conduction by orthogonal collocation technique

P. Sangsurasak
, D. A. Mitchell
, M. Hossain

Research output: Contribution to journal › Article › peer-review

5 Citations (Scopus)

Abstract

Orthogonal collocation is used to solve a simple transient two-dimensional heat transfer problem in which a cylinder cools through conduction at its ends and convection from its side. Orthogonal collocation represents a useful technique for solution of such problems and can easily be adapted to more complex problems.

Original language	English
Pages (from-to)	557-566
Number of pages	10
Journal	International Communications in Heat and Mass Transfer
Volume	20
Issue number	4
DOIs	https://doi.org/10.1016/0735-1933(93)90067-6
Publication status	Published - 1993
Externally published	Yes

ASJC Scopus subject areas

Atomic and Molecular Physics, and Optics
General Chemical Engineering
Condensed Matter Physics

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10.1016/0735-1933(93)90067-6

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@article{5c18a40797ff45f3a3070872cb487e4c,

title = "Transient two dimensional heat conduction by orthogonal collocation technique",

abstract = "Orthogonal collocation is used to solve a simple transient two-dimensional heat transfer problem in which a cylinder cools through conduction at its ends and convection from its side. Orthogonal collocation represents a useful technique for solution of such problems and can easily be adapted to more complex problems.",

author = "P. Sangsurasak and Mitchell, \{D. A.\} and M. Hossain",

year = "1993",

doi = "10.1016/0735-1933(93)90067-6",

language = "English",

volume = "20",

pages = "557--566",

journal = "International Communications in Heat and Mass Transfer",

issn = "0735-1933",

publisher = "Elsevier Ltd",

number = "4",

}

TY - JOUR

T1 - Transient two dimensional heat conduction by orthogonal collocation technique

AU - Sangsurasak, P.

AU - Mitchell, D. A.

AU - Hossain, M.

PY - 1993

Y1 - 1993

N2 - Orthogonal collocation is used to solve a simple transient two-dimensional heat transfer problem in which a cylinder cools through conduction at its ends and convection from its side. Orthogonal collocation represents a useful technique for solution of such problems and can easily be adapted to more complex problems.

AB - Orthogonal collocation is used to solve a simple transient two-dimensional heat transfer problem in which a cylinder cools through conduction at its ends and convection from its side. Orthogonal collocation represents a useful technique for solution of such problems and can easily be adapted to more complex problems.

UR - https://www.scopus.com/pages/publications/0027627273

UR - https://www.scopus.com/pages/publications/0027627273#tab=citedBy

U2 - 10.1016/0735-1933(93)90067-6

DO - 10.1016/0735-1933(93)90067-6

M3 - Article

AN - SCOPUS:0027627273

SN - 0735-1933

VL - 20

SP - 557

EP - 566

JO - International Communications in Heat and Mass Transfer

JF - International Communications in Heat and Mass Transfer

IS - 4

ER -

Transient two dimensional heat conduction by orthogonal collocation technique

Abstract

ASJC Scopus subject areas

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