Two level optimization of key characteristic process and assembly planning

Maqsood Sandhu, Yohanes Kristianto, Petri Helo

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    An integrated assembly sequence planning and fixture layout planning is developed to minimize assembly process variation. The model utilizes design structure matrix (DSM) to re-sequence assembly process by considering product key characteristics (PKC) and assembly key characteristics (AKC). The DSM gives sufficient assembly constraint at minimum number of fixtures. In the next stage, E-optimality criterion is applied to plan fixture layout for 3-D object. The layout maintains assembly process rigidity and stability. The validation shows that the proposed model capable of identifying optimum fixture layout to support assembly sequence planning. The validation results show that minimum Eigen value of E-optimality gives lower assembly variation. Application of AI tools is one of among future research directions that are proposed. Assembly sequence planning and fixture layout planning integration is the result of this article.

    Original languageEnglish
    Title of host publicationInternational Conference on Industrial Logistics, ICIL 2012 - Conference Proceedings
    PublisherUniversity of Zagreb
    Pages493-498
    Number of pages6
    ISBN (Print)9789537738167
    Publication statusPublished - 2012
    Event11th International Conference on Industrial Logistics, ICIL 2012 - Zadar, Croatia
    Duration: Jun 14 2012Jun 16 2012

    Publication series

    NameInternational Conference on Industrial Logistics, ICIL 2012 - Conference Proceedings

    Other

    Other11th International Conference on Industrial Logistics, ICIL 2012
    Country/TerritoryCroatia
    CityZadar
    Period6/14/126/16/12

    Keywords

    • Assembly sequence
    • DSM
    • Fixture layout
    • Key characteristics

    ASJC Scopus subject areas

    • Industrial and Manufacturing Engineering

    Fingerprint

    Dive into the research topics of 'Two level optimization of key characteristic process and assembly planning'. Together they form a unique fingerprint.

    Cite this