Augmentation of heat exchange is considered to be of pivotal importance in many industrial applications. An obvious example on such applications is electronics cooling where improving electronics cooling techniques reduces much of the electronics failures and improves their performance and reliability. In line with that, in this study we conducted a numerical study on the enhancement of the heat removal from hot water co-flowing in a mini-channel in a direct contact manner with lquid metals. Two liquid metal types where considered; gallium and mercury. The hot water after being cooled down in the channel it can recirculate in a closed loop over and over again to the heat generating sites; (for example in electronic boards). Results show that gallium yields higher heat removal from water than mercury by about 15 percent. Overall, the liquid metals lead to superior heat removal from hot water flowing in the channel as compared to the case when only water flows in the channel. Further details and results are presented in the paper.