Validation of simulation platform by comparing results and calculation time of different softwares

Hikmat Achkar, Fabienne Pennec, David Peyrou, Mahmoud Al Ahmad, Marc Sartor, Robert Plana, Patrick Pons

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The need of a powerful multiphysics software, to simulate different topologies of deformable micro structures, is under investigation. The criteria for choosing the software is the precision of the results with an acceptable time of calculation to simulate many models with different variables. The existance of a new software, COMSOL 3.3, at a time linking all the physics and having a good interactive interface seemed to be a good solution. Being new, and under development, COMSOL 3.3 needed to be valid on different points. As a first step, we validated the numerical platform by comparing results Of different softwares and some analytical solutions. The basic advantages and drawbacks of each software were considered for the final decision on the choice of the software that will be used. In terms of time Of calculation, we found very intressting results on the speed of COMSQL to solve the problem when compared to ANSYS, while keeping the same precision of calculation.

Original languageEnglish
Title of host publicationEuroSime 2007
Subtitle of host publicationInternational Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
DOIs
Publication statusPublished - Nov 27 2007
Externally publishedYes
EventEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007 - London, United Kingdom
Duration: Apr 16 2007Apr 18 2007

Publication series

NameEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007

Other

OtherEuroSime 2007: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007
Country/TerritoryUnited Kingdom
CityLondon
Period4/16/074/18/07

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Condensed Matter Physics

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