Variable-segment & variable-driver parallel regeneration techniques for RLC VLSI interconnects

Falah R. Awwad, Mohamed Nekili

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Repeaters are now widely used to enhance the performance of long On-Chip interconnects in CMOS VLSI. For RC-modeled interconnects, parallel repeaters have proved to be superior to serial ones. In this paper, a Variable-Segment Regeneration Technique is introduced and compared with a Variable-driver Parallel Technique, a recently proposed transparent repeater and with three conventional techniques. HSpice Simulations using a 0.25 μm TSMC technology show that both the variable-segment and variable-driver techniques feature 62% time delay saving and 354% Area-Delay product saving over the transparent repeater, and are superior to all conventional techniques. However, our new variable-segment technique is characterized by a 116% Area-Delay product saving over the variable-driver technique. Thus, making it the most performant in the field of high-performance RLC interconnect regeneration. The simulation results confirm the superiority of the parallel regeneration technique over the serial ones.

Original languageEnglish
Title of host publicationGLSVLSI 2002 - Proceedings of the 12th ACM Great Lakes Symposium on VLSI
PublisherAssociation for Computing Machinery, Inc
Pages118-123
Number of pages6
ISBN (Electronic)1581134622, 9781581134629
DOIs
Publication statusPublished - Apr 18 2002
Externally publishedYes
Event12th ACM Great Lakes Symposium on VLSI, GLSVLSI 2002 - New York, United States
Duration: Apr 18 2002Apr 19 2002

Publication series

NameGLSVLSI 2002 - Proceedings of the 12th ACM Great Lakes Symposium on VLSI

Other

Other12th ACM Great Lakes Symposium on VLSI, GLSVLSI 2002
Country/TerritoryUnited States
CityNew York
Period4/18/024/19/02

Keywords

  • Parallel regeneration
  • RLC interconnect
  • Repeater
  • VLSI

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Condensed Matter Physics

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