TY - GEN
T1 - Will thermal noise affect nano-communications?
AU - Santagati, Pietro
AU - Beiu, Valeriu
PY - 2013
Y1 - 2013
N2 - The aim of this paper is to investigate how wire lengths would affect the reliability of scaled CMOS circuits during operations, by analyzing how the Johnson-Nyquist (thermal) noise on the wires affects the probability of failure (defined as the probability of switching) of scaled CMOS transistors. To this end, we consider classical CMOS circuits, and base our analysis on statistical considerations. In particular, we propose a model (that can be extended to more complex devices) for an elementary system which consists of a wire and a 16nm CMOS transistor. The distribution of the energy stored in the wire is also studied analytically, and numerical results are given.
AB - The aim of this paper is to investigate how wire lengths would affect the reliability of scaled CMOS circuits during operations, by analyzing how the Johnson-Nyquist (thermal) noise on the wires affects the probability of failure (defined as the probability of switching) of scaled CMOS transistors. To this end, we consider classical CMOS circuits, and base our analysis on statistical considerations. In particular, we propose a model (that can be extended to more complex devices) for an elementary system which consists of a wire and a 16nm CMOS transistor. The distribution of the energy stored in the wire is also studied analytically, and numerical results are given.
KW - CMOS
KW - nano-communications
KW - thermal noise
KW - wire
UR - http://www.scopus.com/inward/record.url?scp=84876042473&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84876042473&partnerID=8YFLogxK
U2 - 10.1109/ICCSPA.2013.6487322
DO - 10.1109/ICCSPA.2013.6487322
M3 - Conference contribution
AN - SCOPUS:84876042473
SN - 9781467328210
T3 - 2013 1st International Conference on Communications, Signal Processing and Their Applications, ICCSPA 2013
BT - 2013 1st International Conference on Communications, Signal Processing and Their Applications, ICCSPA 2013
T2 - 2013 1st International Conference on Communications, Signal Processing and Their Applications, ICCSPA 2013
Y2 - 12 February 2013 through 14 February 2013
ER -