Will thermal noise affect nano-communications?

Pietro Santagati, Valeriu Beiu

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)

    Abstract

    The aim of this paper is to investigate how wire lengths would affect the reliability of scaled CMOS circuits during operations, by analyzing how the Johnson-Nyquist (thermal) noise on the wires affects the probability of failure (defined as the probability of switching) of scaled CMOS transistors. To this end, we consider classical CMOS circuits, and base our analysis on statistical considerations. In particular, we propose a model (that can be extended to more complex devices) for an elementary system which consists of a wire and a 16nm CMOS transistor. The distribution of the energy stored in the wire is also studied analytically, and numerical results are given.

    Original languageEnglish
    Title of host publication2013 1st International Conference on Communications, Signal Processing and Their Applications, ICCSPA 2013
    DOIs
    Publication statusPublished - 2013
    Event2013 1st International Conference on Communications, Signal Processing and Their Applications, ICCSPA 2013 - Sharjah, United Arab Emirates
    Duration: Feb 12 2013Feb 14 2013

    Publication series

    Name2013 1st International Conference on Communications, Signal Processing and Their Applications, ICCSPA 2013

    Other

    Other2013 1st International Conference on Communications, Signal Processing and Their Applications, ICCSPA 2013
    Country/TerritoryUnited Arab Emirates
    CitySharjah
    Period2/12/132/14/13

    Keywords

    • CMOS
    • nano-communications
    • thermal noise
    • wire

    ASJC Scopus subject areas

    • Computer Networks and Communications
    • Signal Processing

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